Eksentricity

Samsung Kicks Off Mass Production of Ultra-Thin Memory Chips for On-Device AI

August 6, 2024

12nm LPDDR5X DRAM: Samsung begins mass production of the industry’s thinnest 12-nanometer-class LPDDR5X DRAM, available in 12GB and 16GB packages.
Thermal Management: The ultra-slim design facilitates better airflow and thermal control, crucial for high-performance applications.
Future Expansion: Samsung aims to develop even thinner modules, including 6-layer 24GB and 8-layer 32GB packages.

Enhanced Device Performance: The new memory chips support advanced on-device AI, improving the performance of mobile devices.
Space Efficiency: The thin design of the DRAM packages saves space in devices, potentially allowing for more compact and efficient hardware designs.
Market Expansion: Samsung’s innovations could strengthen its position in the low-power DRAM market, catering to increasing demand for high-density memory solutions.
Thermal Improvements: Better thermal management may lead to longer device lifespans and improved user experiences.